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About the Journal
Editor-in-Chief:
T. Kaczorek, Warsaw University of Technology

Deputy Editor-in Chief:
M. Kaźmierkowski, Warsaw University of Technology
A. Rogalski, Division IV Technical Sciences PAN

Board of Co-editors:
Artificial and Computational Intelligence
S. Osowski and B. Sawicki, Warsaw University of Technology

Biomedical Engineering and Biotechnology
A. Liebert and R. Maniewski, Institute of Biocybernetics and Biomedical Engineering PAN

Civil Engineering
L. Czarnecki, Building Research Institute, ITB, Warsaw

Control, Robotics and Informatics
J. Klamka and A. Babiarz, Silesian Technical University
A. Borkowski, Institute of Fundamental Technological Research PAN

Electronics, Telecommunication and Optoelectronics
M. Mrozowski and A. Lamęcki, Gdansk University of Technology
W. Woliński, Warsaw University of Technology

Mechanical and Aeronautical Engineering, Thermodynamics
A. Styczek and A. Tylikowski, Warsaw University of Technology

Materials Science and Nanotechnology
B. Major and P. Czaja, Institute of Metallurgy and Materials Science PAN
T.A. Kowalewski and B. Blachowski, Institute of Fundamental Technological Research PAN

Power Systems and Power Electronics
M.P. Kazmierkowski, Warsaw University of Technology

International Editorial Advisory Board
I.V. Alexandrov, Ufa State Aviation Technical University, Russia
R. Asthana, University of Wiscontin-Stout, Menomonie, USA
Xu Binshi, China Association of Plant Engineering, Beijing, P.R. China
F. Blaabjerg, Aalborg University, Denmark
C. Cecati, University of L’Aquila, Italy
A. Cichocki, RIKEN Institute, Tokyo, Japan
M. David, National Polytechnique de Toulouse, France
R. Ebner, Materials Centre Leoben, Leoben, Austria
E. Fornasini, University of Padova, Padova, Italy
L.G. Franquelo, University of Sevilla, Spain
M. Gad-el-Hak, Virginia Commonwealth University, Richmond, USA
D. van Gemert, Catholic University Leuven, KU Leuven, Belgium
L. Keviczky, Hungarian Academy of Sciences, Budapest, Hungary
V. Kučera, Czech Technical University in Prague, Prague, Czech Republic
R. Kennel, Technical University Munich, Germany
E. Levi, Liverpool John Moore University, UK
G. Maier, Technical University of Milan, Milan, Italy
K.F. Man, City University of Hong Kong,
H.A. Mang, Austrian Academy of Sciences, Vienna, Austria
H. Mihashi, Tohoku University, Aoba-ku, Sendai, Japan
S. Mindess, University of British Columbia, Vancouver, Canada
D.A. Mlynski, University of Karlsruhe, Karlsruhe, Germany
A.S. Nowak, University of Michigan, Ann Arbor, USA
K. Ohnishi, Keio University, Yokohama, Japan
A. Öberg, Linköping University, Linköping, Sweden
W. Pedrycz, University of Alberta, Canada
S. Przemieniecki, University of South Florida, Tampa, USA
M. Razeghi, Northwestern University, Evanston, USA
J. Rodriguez, Technical University of Federico Santa Maria, Valparaiso, Chile
J.V. Sloten, Catholic University Leuven, Leuven, Belgium
B.M. Wilamowski, University of Auburn, Alabama, USA
W. Włosiński, Warsaw University of Technology, Warsaw, Poland
A.L. Yarin, Institute of Illinois at Chicago, USA
Du Xiangwan, Chinese Academy of Engineering, China
J. Żurada, Department of Computer Engineering, University of Louisville, USA

Copy Editor
A. Jurkiewicz, e-mail: biuletyn@pan.pl
Phone: +48(22)182-68-52

Address:
Pałac Kultury i Nauki,
Wydział IV PAN,
PL 00-901 Warszawa
 
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